Methods related to through-mold openings for dual-sided packaged modules with ball grid arrays

ABSTRACT

According to certain aspects, a method can include: providing a packaging substrate having an upper side, a lower side, and a ground plane; implementing a radio-frequency circuit assembly on both of the upper and lower sides; forming an upper overmold on the upper side to cover an upper portion of the radio-frequency circuit assembly; forming one or more openings through the upper overmold to expose contact pads on the upper side; covering an upper surface and the one or more openings of the upper overmold with a conductive layer; implementing a plurality of contact features on the lower side; forming a lower overmold on the lower side to cover a lower portion of the radio-frequency circuit assembly and some or all of each of the contact features on the lower side; and processing the lower overmold to expose the contact features to allow the dual-sided module to be mounted on a circuit board.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a continuation of U.S. patent application Ser. No.16/035,589, filed Jul. 14, 2018, entitled “THROUGH-MOLD OPENINGS FORDUAL-SIDED PACKAGED MODULES WITH BALL GRID ARRAYS,” which claimspriority to U.S. Provisional Application No. 62/534,052, filed Jul. 18,2017, entitled “THROUGH-MOLD OPENINGS FOR DUAL-SIDED PACKAGED MODULESWITH BALL GRID ARRAYS.” The contents of the above-referencedapplication(s) are hereby expressly incorporated by reference in theirentireties for all purposes. This application incorporates by referencein its entirety, U.S. application Ser. No. 15/705,230, filed Sep. 14,2017, entitled “THROUGH-MOLD FEATURES FOR SHIELDING APPLICATIONS.” Thisapplication incorporates by reference in its entirety, U.S. applicationSer. No. 15/724,722, filed Oct. 4, 2017, entitled “DUAL-SIDEDRADIO-FREQUENCY PACKAGE WITH OVERMOLD STRUCTURE.”

BACKGROUND Field

The present disclosure generally relates to packaging of circuitdevices.

Description of the Related Art

The present disclosure relates to fabrication of packaged electronicmodules such as radio-frequency (RF) modules. In radio-frequency (RF)applications, RF circuits and related devices can be implemented in apackaged module. Such a packaged module can then be mounted on a circuitboard such as a phone board.

SUMMARY

In accordance with some implementations, the present disclosure relatesto a dual-sided module comprising a packaging substrate having an upperside, a lower side, and a ground plane. The dual-sided module furthercomprises a radio-frequency circuit assembly implemented on both of theupper and lower sides of the packaging substrate, and an upper overmoldimplemented on the upper side of the packaging substrate to cover anupper portion of the radio-frequency circuit assembly, the upperovermold defining one or more openings dimensioned to expose one or morecontact pads on the upper side of the packaging substrate, the one ormore contact pads in electrical connection with the ground plane. Thedual-sided module may further include a conductive layer configured tocover an upper surface and the one or more openings of the upperovermold to be in electrical contact with the ground plane to therebyprovide shielding for a region on the upper side of the packagingsubstrate, a lower overmold implemented on the lower side of thepackaging substrate to cover a lower portion of the radio-frequencycircuit assembly, the lower overmold defining a plurality of openingsand a contact feature implemented within each of the openings of thelower overmold to be in contact with the packaging substrate, such thatthe resulting contact features allow the dual-sided module to be mountedon a circuit board.

In some embodiments, the one or more openings defined by the upperovermold includes one or more through-mold vias. In some embodiments,the one or more through-mold vias are configured to provide shieldingbetween the region on the upper side of the packaging substrate andanother location.

In some embodiments, the other location is a location that is externalto the dual-sided module. In some embodiments, the other location is alocation that is within the dual-sided module to thereby provideintra-module shielding.

In some embodiments, the conductive layer is further configured to coversome or all of side walls defined by the dual-sided module. In someembodiments, the packaging substrate further includes a contact featureelectrically connected to the ground plane and exposed on each of theside walls, such that the conductive layer on the corresponding sidewall is further electrically connected to the ground plane through thecontact feature. In some embodiments, the conductive layer isimplemented as a conformal coating of conductive material.

In some embodiments, each of the one or more openings defined by thelower overmold includes a through-mold opening dimensioned to receivethe corresponding contact feature. In some embodiments, the contactfeature includes a solder ball. In some embodiments, the through-moldopening includes a side sectional profile having a maximum width at alower surface of the lower overmold.

In some embodiments, the solder ball is dimensioned and positionedwithin the through-mold opening such that a lower portion of the solderball is a level that is approximately the same as the lower surface ofthe lower overmold. In some embodiments, the solder ball and thecorresponding through-mold opening define a ring-shaped space aroundlower portion of the solder ball to facilitate the mounting of thedual-sided module on the circuit board. In some embodiments, the contactfeatures are configured as a ball grid array.

In some embodiments, each opening defined by the lower overmold isimplemented by the lower overmold being formed around the correspondingball of the ball grid array. In some embodiments, the opening defined bythe lower overmold includes a side sectional profile having a maximumwidth at a lower surface of the lower overmold.

In some embodiments, the lower portion of the radio-frequency circuitincludes a semiconductor die having a radio-frequency circuit. In someembodiments, the lower overmold is dimensioned to substantiallyencapsulate the semiconductor die. In some embodiments, the plurality ofopenings of the lower overmold substantially surrounds the semiconductordie. In some embodiments, the contact features associated with theplurality of openings of the lower overmold are configured and arrangedin a pattern as a ball grid array or a land grid array.

In some embodiments, the pattern of the contact features is dimensionedsuch that some or all of a lateral region occupied by the semiconductordie displaces grounding connections of the dual-sided module.

The present disclosure also relates to a method for manufacturing adual-sided module. The method comprises providing or forming a packagingsubstrate having an upper side, a lower side, and a ground plane. Themethod includes implementing a radio-frequency circuit assembly on bothof the upper and lower sides of the packaging substrate, forming anupper overmold on the upper side of the packaging substrate to cover anupper portion of the radio-frequency circuit assembly and forming one ormore openings through the upper overmold to expose one or more contactpads on the upper side of the packaging substrate, the one or morecontact pads in electrical connection with the ground plane. The methodmay further include covering an upper surface and the one or moreopenings of the upper overmold with a conductive layer to be inelectrical contact with the ground plane to thereby provide shieldingfor a region on the upper side of the packaging substrate, forming alower overmold on the lower side of the packaging substrate to cover alower portion of the radio-frequency circuit assembly, forming aplurality of openings through the lower overmold to expose correspondingcontact pads on the lower side of the packaging substrate, andimplementing a contact feature within each of the openings of the lowerovermold to be in contact with the corresponding contact pad, such thatthe resulting contact features allow the dual-sided module to be mountedon a circuit board.

The present disclosure also relates to a method for manufacturing adual-sided module. The method comprises providing or forming a packagingsubstrate having an upper side, a lower side, and a ground plane. Themethod includes implementing a radio-frequency circuit assembly on bothof the upper and lower sides of the packaging substrate, forming anupper overmold on the upper side of the packaging substrate to cover anupper portion of the radio-frequency circuit assembly and forming one ormore openings through the upper overmold to expose one or more contactpads on the upper side of the packaging substrate, the one or morecontact pads in electrical connection with the ground plane. The methodmay further include covering an upper surface and the one or moreopenings of the upper overmold with a conductive layer to be inelectrical contact with the ground plane to thereby provide shieldingfor a region on the upper side of the packaging substrate, implementinga plurality of contact features on the lower side of the packagingsubstrate, forming a lower overmold on the lower side of the packagingsubstrate to cover a lower portion of the radio-frequency circuitassembly and some or all of each of the contact features on the lowerside of the packaging substrate, and processing the lower overmold toexpose the contact features to allow the dual-sided module to be mountedon a circuit board.

The present disclosure also relates to a method for manufacturing adual-sided module. The method comprises providing or forming a panelhaving an upper side and a lower side, each unit including a packagingsubstrate having a ground plane, and implementing a radio-frequencycircuit assembly on both of the upper and lower sides of the packagingsubstrate of each unit. The method includes forming an upper overmold onthe upper side of the panel to cover an upper portion of theradio-frequency circuit assembly of each unit, forming one or moreopenings through the upper overmold to expose one or more contact padson the upper side of the packaging substrate of each unit, the one ormore contact pads in electrical connection with the ground plane, andforming a lower overmold on the lower side of the panel to cover a lowerportion of the radio-frequency circuit assembly of each unit. The methodmay further include forming a plurality of openings through the lowerovermold to expose corresponding contact pads on the lower side of thepackaging substrate of each unit and implementing a contact featurewithin each of the openings of the lower overmold to be in contact withthe corresponding contact pad to thereby result in an panel assembly.

In some embodiments, the method further comprises singulating the panelassembly to result in a plurality of singulated units. In someembodiments, the method further comprises, prior to the singulating,covering an upper surface and the openings of the upper overmold with aconductive layer to be in electrical contact with the ground plane ofeach packaging substrate to thereby provide shielding for a region onthe upper side of the packaging substrate.

In some embodiments, the method further comprises, after thesingulating, covering an upper surface and the openings of a singulatedupper overmold and side walls of each singulated unit with a conductivelayer to be in electrical contact with the ground plane of eachpackaging substrate to thereby provide conformal shielding forsingulated unit. In some embodiments, the covering is performed for theplurality of the singulated units together in an array.

The present disclosure also relates to a method for manufacturing aplurality of dual-sided modules. The method comprises providing orforming a panel having an upper side and a lower side, each unitincluding a packaging substrate having a ground plane, implementing aradio-frequency circuit assembly on both of the upper and lower sides ofthe packaging substrate of each unit and forming an upper overmold onthe upper side of the panel to cover an upper portion of theradio-frequency circuit assembly of each unit. The method may furtherinclude forming one or more openings through the upper overmold toexpose one or more contact pads on the upper side of the packagingsubstrate of each unit, the one or more contact pads in electricalconnection with the ground plane and implementing a plurality of contactfeatures on the lower side of each unit. The method may further includeforming a lower overmold on the lower side of the panel to cover a lowerportion of the radio-frequency circuit assembly and some or all of eachof the contact features on the lower side of each unit, and processingthe lower overmold to expose the contact features.

In some embodiments, the method further comprises singulating the panelassembly to result in a plurality of singulated units. In someembodiments, the method further comprises, prior to the singulating,covering an upper surface and the openings of the upper overmold with aconductive layer to be in electrical contact with the ground plane ofeach packaging substrate to thereby provide shielding for a region onthe upper side of the packaging substrate.

In some embodiments, the method further comprises, after thesingulating, covering an upper surface and the openings of a singulatedupper overmold and side walls of each singulated unit with a conductivelayer to be in electrical contact with the ground plane of eachpackaging substrate to thereby provide conformal shielding forsingulated unit. In some embodiments, the covering is performed for theplurality of the singulated units together in an array.

The present disclosure also relates to a wireless device comprising acircuit board configured to receive a plurality of components, atransceiver implemented on the circuit board and configured to processradio-frequency signals, and a dual-sided module implemented on thecircuit board and in communication with the transceiver. The dual-sidedmodule may include a packaging substrate having an upper side, a lowerside, and a ground plane, a radio-frequency circuit assembly implementedon both of the upper and lower sides of the packaging substrate, anupper overmold implemented on the upper side of the packaging substrateto cover an upper portion of the radio-frequency circuit assembly, theupper overmold defining one or more openings dimensioned to expose oneor more contact pads on the upper side of the packaging substrate, andthe one or more contact pads in electrical connection with the groundplane. The dual-sided module may include a conductive layer configuredto cover an upper surface and the one or more openings of the upperovermold to be in electrical contact with the ground plane to therebyprovide shielding for a region on the upper side of the packagingsubstrate, a lower overmold implemented on the lower side of thepackaging substrate to cover a lower portion of the radio-frequencycircuit assembly, the lower overmold defining a plurality of openings,and a contact feature implemented within each of the openings of thelower overmold to allow the dual-sided module to be mounted on a circuitboard.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a dual-sided packaged radio-frequency module having ashielding functionality, in accordance with some implementations.

FIG. 2 illustrates a dual-sided RF module having a packaging substrateconfigured to receive one or more components on its first side, and toreceive one or more components on its second side, in accordance withsome implementations.

FIG. 3 illustrates a dual-sided RF module with a packaging substrateconfigured to receive one or more components on its first side, and toreceive one or more components on its second side, in accordance withsome implementations.

FIG. 4A illustrates a packaging substrate panel having a plurality ofunits, in accordance with some implementations.

FIG. 4B illustrates a plurality of components mounted on the upper sideof a packaging substrate, in accordance with some implementations.

FIG. 4C illustrates a first overmold structure formed over a packagingsubstrate panel, in accordance with some implementations.

FIG. 4D illustrates a plurality of components mounted on the undersideof a packaging substrate panel, in accordance with some implementations.

FIG. 4E illustrates a second overmold structure formed over a packagingsubstrate panel, in accordance with some implementations.

FIG. 4F illustrates a first overmold structure having one or moreopenings, in accordance with some implementations.

FIG. 4G illustrates a packaging substrate panel with a solder ballprovided into each of the openings formed on the second overmoldstructure, in accordance with some implementations.

FIG. 4H illustrates an assembly oriented and prepared to receive aconductive layer on the first overmold structure, in accordance withsome implementations.

FIG. 4I illustrates a packaging substrate panel with a conductive layerformed in a conformal manner so as to cover the upper surface of anovermold, in accordance with some implementations.

FIG. 4J illustrates an assembly of packaging substrates singulated intoa plurality of dual-sided shielded RF modules, in accordance with someimplementations.

FIG. 5A illustrates a packaging substrate panel having a plurality ofunits, in accordance with some implementations.

FIG. 5B illustrates a plurality of components mounted on the upper sideof a packaging substrate, in accordance with some implementations.

FIG. 5C illustrates a first overmold structure formed over a packagingsubstrate panel, in accordance with some implementations.

FIG. 5D illustrates a plurality of components mounted on the undersideof a packaging substrate panel, in accordance with some implementations.

FIG. 5E illustrates a second overmold structure formed over a packagingsubstrate panel, in accordance with some implementations.

FIG. 5F illustrates a first overmold structure having one or moreopenings, in accordance with some implementations.

FIG. 5G illustrates a packaging substrate panel with a solder ballprovided into each of the openings formed on the second overmoldstructure, in accordance with some implementations.

FIG. 5H illustrates an assembly oriented and prepared to receive aconductive layer on the first overmold structure, in accordance withsome implementations.

FIG. 5I illustrates a plurality of singulated, unshielded modules, inaccordance with some implementations.

FIG. 5J illustrates a plurality of dual-sided shielded RF modules, inaccordance with some implementations.

FIG. 6A illustrates a packaging substrate panel, in accordance with someimplementations.

FIG. 6B illustrates a plurality of components mounted on the upper sideof a packaging substrate, in accordance with some implementations.

FIG. 6C illustrates a first overmold structure formed over a packagingsubstrate panel, in accordance with some implementations.

FIG. 6D illustrates a plurality of components mounted on the undersideof a packaging substrate panel, in accordance with some implementations.

FIG. 6E illustrates a second overmold structure formed over a packagingsubstrate panel, in accordance with some implementations.

FIG. 6F illustrates a first overmold structure having one or moreopenings, in accordance with some implementations.

FIG. 6G illustrates a packaging substrate panel with a solder ballprovided into each of the openings formed on the second overmoldstructure, in accordance with some implementations.

FIG. 6H illustrates a plurality of dual-sided shielded RF modules, inaccordance with some implementations.

FIG. 7A illustrates a packaging substrate panel, in accordance with someimplementations.

FIG. 7B illustrates a plurality of components mounted on the upper sideof a packaging substrate, in accordance with some implementations.

FIG. 7C illustrates a first overmold structure formed over a packagingsubstrate panel, in accordance with some implementations.

FIG. 7D illustrates a plurality of components mounted on the undersideof a packaging substrate panel, in accordance with some implementations.

FIG. 7E illustrates a second overmold structure formed over a packagingsubstrate panel, in accordance with some implementations.

FIG. 7F illustrates a first overmold structure having one or moreopenings, in accordance with some implementations.

FIG. 7G illustrates a packaging substrate panel with a solder ballprovided into each of the openings formed on the second overmoldstructure, in accordance with some implementations.

FIG. 7H illustrates a plurality of dual-sided shielded RF modules, inaccordance with some implementations.

FIG. 8A illustrates a packaging substrate panel, in accordance with someimplementations.

FIG. 8B illustrates a plurality of components mounted on the upper sideof a packaging substrate, in accordance with some implementations.

FIG. 8C illustrates a first overmold structure formed over a packagingsubstrate panel, in accordance with some implementations.

FIG. 8D illustrates a plurality of components mounted on the undersideof a packaging substrate panel oriented with the first overmoldstructure flipped downward, in accordance with some implementations.

FIG. 8E illustrates a second overmold structure formed over a packagingsubstrate panel, in accordance with some implementations.

FIG. 8F illustrates at least a portion of the second overmold structureand one or more solder balls removed, in accordance with someimplementations.

FIG. 8G illustrates a packaging substrate panel with a first overmoldstructure having one or more openings, in accordance with someimplementations.

FIG. 8H illustrates an assembly oriented and prepared to receive aconductive layer on the first overmold structure, in accordance withsome implementations.

FIG. 8I illustrates a plurality of dual-sided shielded RF modules, inaccordance with some implementations.

FIG. 9A illustrates a packaging substrate panel, in accordance with someimplementations.

FIG. 9B illustrates a plurality of components mounted on the upper sideof a packaging substrate, in accordance with some implementations.

FIG. 9C illustrates a first overmold structure formed over a packagingsubstrate panel, in accordance with some implementations.

FIG. 9D illustrates a plurality of components mounted on the undersideof a packaging substrate panel oriented with the first overmoldstructure flipped downward, in accordance with some implementations.

FIG. 9E illustrates a second overmold structure formed over a packagingsubstrate panel, in accordance with some implementations.

FIG. 9F illustrates a packaging substrate panel with a first overmoldstructure having one or more openings and at least a portion of thesecond overmold structure and one or more solder balls removed, inaccordance with some implementations.

FIG. 9G illustrates a plurality of singulated, unshielded modules, inaccordance with some implementations.

FIG. 9H illustrates a plurality of dual-sided shielded RF modules, inaccordance with some implementations.

FIG. 10 depicts an example wireless device having one or moreadvantageous features described herein.

DESCRIPTION

The headings provided herein, if any, are for convenience only and donot necessarily affect the scope or meaning of the claimed invention.

FIG. 1 depicts a dual-sided packaged radio-frequency (RF) module 100having a shielding functionality. As described herein, such a packagedmodule can include one or more openings implemented through an overmoldstructure on a first side of the module and configured to facilitatesuch shielding functionality. As also described herein, such a packagedmodule can include a plurality of openings on a second side of themodule and configured to facilitate structures for providing electricalcontacts and/or mounting functionality for the module. Various examplesrelated both sides of the module are described herein in greater detail.

For the purpose of description, a first side of a dual-sided module canbe an upper side when the module is mounted on a circuit board such as aphone board. Accordingly, a second side of the dual-sided module can bea lower side or underside when in such an orientation. It will beunderstood that first and second sides can also be lower and uppersides, respectively, when in a mounted orientation.

Also for the purpose of description, various examples are described inthe context of RF applications. However, it will be understood that oneor more features of the present disclosure can also be implemented innon-RF packaging applications.

FIGS. 2 and 3 show non-limiting examples of a dual-sided RF module 100having one or more features as described herein. In the example of FIG.2, a dual-sided RF module 100 can include a packaging substrate 102configured to receive one or more components on its first side (e.g.,upper side), and to receive one or more components on its second side(e.g., underside). For the purpose of description, it will be understoodthat the packaging substrate 102 (e.g., a laminate substrate) includesvarious conductive features to facilitate such components on its firstand second sides. It will also be understood the packaging substrate 102also includes one or more ground planes to facilitate the module'sshielding functionality.

In FIG. 2, shielding functionality of the module 100 is shown to befacilitated by a conductive layer 702 implemented on an upper surface ofan overmold structure 103 that is shown to encapsulate examplecomponents 107 a, 107 b mounted on the packaging substrate 102. Suchcomponents can include, for example, a semiconductor die having an RFcircuit, a surface-mount device (SMD) such as a passive component, etc.

In FIG. 2, an electrical connection between the conductive layer 702 anda portion of the packaging substrate 102 is shown to be facilitated by aplurality of openings such as through-mold vias (TMVs) 700. For example,the conductive layer 702 can extend into each the TMVs 700 so as to forman electrical connection with, for example, a contact pad on the uppersurface of the packaging substrate 102. Such a contact pad can beelectrically connected to a ground plane within the packaging substrate102, thereby providing shielding functionality for the module 100.

In the example of FIG. 2, the TMVs 700 having associated conductivefeatures (e.g., extension of the conductive layer 702) can be arrangedto provide, for example, shielding functionality between an internalregion of the module (e.g. an upper internal region where the components107 a, 107 b are located) and a region external to the module 100. Insome embodiments, such TMVs can be arranged to form a partial or fullperimeter around the internal region.

It will be understood that in the example of FIG. 2, the module 100 caninclude one or more TMVs 700 (with or without the foregoing perimeterarrangement of TMVs) providing electrical connection similar to theabove example. Such one or more TMVs can be arranged to provideshielding between first and second regions of the module (also referredto as intra-module shielding).

Additional details concerning such TMVs of FIG. 2 facilitating shieldingfunctionality, as well as examples of variations, are disclosed inAppendix A.

In the example of FIG. 2, the conductive layer 702 generally does notcover the side walls of the module 100. As described herein, such afeature can allow more process steps to be performed while an array ofsuch modules are together in, for example, a panel format.

In the example of FIG. 3, a dual-sided RF module 100 can include apackaging substrate 102 configured to receive one or more components onits first side (e.g., upper side), and to receive one or more componentson its second side (e.g., underside). For the purpose of description, itwill be understood that the packaging substrate 102 (e.g., a laminatesubstrate) includes various conductive features to facilitate suchcomponents on its first and second sides. It will also be understood thepackaging substrate 102 also includes one or more ground planes tofacilitate the module's shielding functionality.

In FIG. 3, shielding functionality of the module 100 is shown to befacilitated by a conductive layer 704 implemented on an upper surface ofan overmold structure 103 that is shown to encapsulate examplecomponents 107 a, 107 b mounted on the packaging substrate 102. Suchcomponents can include, for example, a semiconductor die having an RFcircuit, a surface-mount device (SMD) such as a passive component, etc.The conductive layer 704 is shown to also cover the side walls of themodule 100. In some embodiments, such a conductive layer can beimplemented as, for example, a conformal layer of conductive material.

In FIG. 3, an electrical connection between the conductive layer 704 anda portion of the packaging substrate 102 is shown to be facilitated byone or more openings such as through-mold vias (TMVs) 700. For example,the conductive layer 704 can extend into each the TMVs 700 so as to forman electrical connection with, for example, a contact pad on the uppersurface of the packaging substrate 102. Such a contact pad can beelectrically connected to a ground plane within the packaging substrate102, thereby providing shielding functionality for the module 100.

In FIG. 3, an electrical connection between the conductive layer 704 andthe ground plane can also be made through a conductive feature exposedon each side wall so as to form an electrical contact with the side-wallportion of the conductive layer 704. Such a conductive feature can be inelectrical connection with the ground plane.

In the example of FIG. 3, the conformal conductive layer 704 inelectrical connection with the ground plane can provide, for example,shielding functionality between an internal region of the module (e.g. aregion within the side walls) and a region external to the module 100.Further, the one or more TMVs 700 providing electrical connectionbetween the conductive layer 704 and the ground plane, can provideshielding between first and second regions of the module (also referredto as intra-module shielding). For example, the first region can be aregion where the first component 107 a is located, and the second regioncan be a region where the second component 107 b is located.

Additional details concerning such TMV(s) of FIG. 3 being utilized witha conformal conductive layer, as well as examples of variations, aredisclosed in Appendix A.

In each of the examples of FIGS. 2 and 3, the underside of the packagingsubstrate 102 can include one or more components mounted thereto. Forexample, a component 109 such as a semiconductor die having an RFcircuit can be mounted on the underside of the packaging substrate 102.

In FIGS. 2 and 3, an overmold structure 105 is shown to be formed toencapsulate the component 109. Such an overmold can include a pluralityof openings 710 that extend between the underside of the packagingsubstrate 102 and the lower surface of the overmold 105. In someembodiments, such openings can facilitate implementation of featuresthat provide mounting and/or electrical connection functionalities forthe module 100.

In the examples shown in FIGS. 2 and 3, the openings 710 are shown to beformed through the overmold 105, and features such as solder balls 712are shown to be formed within such openings. Such solder balls can be inelectrical contact with the underside of the packaging substrate 102 toprovide, for example, grounding and/or non-grounding connections for themodule 100. Such solder balls can also facilitate mounting of the module100 on a circuit board such as a phone board. Such solder balls may alsoprovide for electrical (e.g., conductive) connections between the module100, components of the module 100, and/or a circuit board. The solderballs (e.g., solder balls 712) described herein may be referred to ascontact features or through-mold connections. Other examples ofthrough-mold connections and/or contact features include, but are notlimited to, solder balls, pillars, columns, posts, pedestals, etc.

Additional details concerning such underside configuration of FIGS. 2and 3, as well as examples of variations, are disclosed in Appendix B.

In some embodiments, a plurality of shielded RF modules having one ormore features as described herein can be fabricated while in a panelformat for some or all of various process steps. FIGS. 4A-4T showvarious example stages of a fabrication process that can be utilized tomanufacture a plurality of shielded RF modules that do not haveconductive side-wall layers. FIGS. 5A-5T show various example stages ofa fabrication process that can be utilized to manufacture a plurality ofshielded RF modules that have conductive side walls.

FIG. 4A shows a panel 130 having a plurality of units 131, where eachunit is configured to become a packaging substrate 102 once singulated.Each unit 131 can include one or more contact pads on its upper side,and it is assumed that each of such contact pad(s) is electricallyconnected to a ground plane within the packaging substrate 102. Eachunit 131 can also include a plurality of contact pads on its underside,and it is assumed that each of such contact pads are configured tofacilitate mounting of one or more components and/or to receiveconductive features such as solder balls.

FIG. 4B shows a plurality of components 107 a, 107 b mounted on theupper side of the packaging substrate 102 for each unit 131 of the panel130. Such components can include, for example, one or more die havingrespective integrated circuit(s), one or more surface mount devices(SMDs) such as passive components, or some combination thereof. Suchcomponents can be parts of an RF circuit assembly.

FIG. 4C shows that a first overmold structure 136 can be formed over thepackaging substrate panel 130 so as to cover each set of one or morecomponents 107 a, 107 b associated with the corresponding unit.

FIG. 4D shows a plurality of components 109 mounted on the underside ofthe packaging substrate panel 130. In the example shown, one component109 is mounted on the underside of each unit 131 of the panel 130;however, it will be understood that more than one component can bemounted thereto. Such components can include, for example, one or moredie having respective integrated circuit(s), one or more surface mountdevices (SMDs) such as passive components, or some combination thereof.Such components can be parts of an RF circuit assembly.

FIG. 4E shows that a second overmold structure 137 can be formed overthe packaging substrate panel 130 so as to cover each set of one or morecomponents 109 associated with the corresponding unit.

FIG. 4F shows that one or more openings such as through-mold vias (TMVs)700 can be formed through the first overmold structure 136. Such TMVscan be formed to expose at least some of the corresponding contact padson the first side of the packaging substrate. In some embodiments, suchTMVs can be formed by, for example, laser drilling configured to burnthrough the first overmold material and generally stop once the contactpads are exposed.

FIG. 4F also shows that a plurality of openings 710 can be formedthrough the second overmold structure 137. Such openings can be formedto expose at least some of the corresponding contact pads on the secondside of the packaging substrate. In some embodiments, such openings canbe formed by, for example, laser drilling configured to burn through thesecond overmold material and generally stop once the contact pads areexposed.

FIG. 4G shows that a solder ball 712 can be provided into each of theopenings 710 formed on the second overmold structure 137. Such a solderball can be provided so as to form a robust mechanical and electricalcontact with the corresponding contact pad on the second side of thepackaging substrate.

FIG. 4H shows the assembly of FIG. 4G oriented and prepared to receive aconductive layer on the first overmold structure 136.

FIG. 4I shows that a conductive layer 702 can be formed in a conformalmanner so as to cover the upper surface of the overmold 136, the surfaceof each TMV 700, and the exposed portion of the corresponding contactpad. Accordingly, the conductive layer 702 on the upper surface of theovermold 136 can be electrically connected to the ground planes in thepanel 130 through the respective conductive-material-coated TMVs. Such aconformal coating of conductive material can be applied by, for example,a deposition process such as a physical vapor deposition (PVD) process.

FIG. 4J shows that the assembly of FIG. 4I can be singulated into aplurality of dual-sided shielded RF modules 100, each having one or morecomponents mounted on the first side (e.g., upper side) of thecorresponding packaging substrate 102, and one or more componentsmounted on the second side (e.g., underside) of the same packagingsubstrate 102. As described herein, the conductive-material-coated TMVsprovide an electrical connection between the conductive layer on theupper surface of the overmold 103 of each module 100 and the contactpads (which are in turn electrically connected to a ground plane), tothereby provide shielding functionality (e.g., intra-module shieldingand/or overall shielding for the module). As also described herein, suchconductive-material-coated TMVs can replace shielding wirebonds, therebyeliminating process steps such as formation of shielding wirebonds,exposing of upper portions of such shielding wirebonds (e.g., utilizingmicro-ablation technique), and formation of a conductive layer such as apainted metal layer to accommodate such shielding wirebonds.

As also described herein, the array of solder balls 712 implemented onthe underside of the packaging substrate 102 in the correspondingopenings 710 in the overmold 105 can allow the module 100 to be mountedon a circuit board. Additional details concerning such mounting with useof the solder ball array are described in Appendix B.

FIG. 5A shows a panel 140 having a plurality of units 141, where eachunit is configured to become a packaging substrate 102 once singulated.Each unit 141 can include one or more contact pads on its upper side,and it is assumed that each of such contact pad(s) is electricallyconnected to a ground plane within the packaging substrate 102. Eachunit 141 can also include a plurality of contact pads on its underside,and it is assumed that each of such contact pads are configured tofacilitate mounting of one or more components and/or to receiveconductive features such as solder balls.

FIG. 5B shows a plurality of components 107 a, 107 b mounted on theupper side of the packaging substrate 102 for each unit 141 of the panel140. Such components can include, for example, one or more die havingrespective integrated circuit(s), one or more surface mount devices(SMDs) such as passive components, or some combination thereof. Suchcomponents can be parts of an RF circuit assembly.

FIG. 5C shows that a first overmold structure 146 can be formed over thepackaging substrate panel 140 so as to cover each set of one or morecomponents 107 a, 107 b associated with the corresponding unit.

FIG. 5D shows a plurality of components 109 mounted on the underside ofthe packaging substrate panel 140. In the example shown, one component109 is mounted on the underside of each unit 141 of the panel 140;however, it will be understood that more than one component can bemounted thereto. Such components can include, for example, one or moredie having respective integrated circuit(s), one or more surface mountdevices (SMDs) such as passive components, or some combination thereof.Such components can be parts of an RF circuit assembly.

FIG. 5E shows that a second overmold structure 147 can be formed overthe packaging substrate panel 140 so as to cover each set of one or morecomponents 109 associated with the corresponding unit.

FIG. 5F shows that one or more openings such as through-mold vias (TMVs)700 can be formed through the first overmold structure 146. Such TMVscan be formed to expose at least some of the corresponding contact padson the first side of the packaging substrate. In some embodiments, suchTMVs can be formed by, for example, laser drilling configured to burnthrough the first overmold material and generally stop once the contactpads are exposed.

FIG. 5F also shows that a plurality of openings 710 can be formedthrough the second overmold structure 147. Such openings can be formedto expose at least some of the corresponding contact pads on the secondside of the packaging substrate. In some embodiments, such openings canbe formed by, for example, laser drilling configured to burn through thesecond overmold material and generally stop once the contact pads areexposed.

FIG. 5G shows that a solder ball 712 can be provided into each of theopenings 710 formed on the second overmold structure 147. Such a solderball can be provided so as to form a robust mechanical and electricalcontact with the corresponding contact pad on the second side of thepackaging substrate.

FIG. 5H shows the assembly of FIG. 5G oriented and prepared to besingulated. It will be understood that the assembly of FIG. 5G can alsobe singulated in the orientation as shown in FIG. 5G.

FIG. 5I shows a plurality of unshielded modules 100′ resulting from asingulation process. Such unshielded modules can be process furtherutilizing, for example, a stencil. Additional details concerning suchstencil based processing of singulated devices are disclosed in AppendixA.

FIG. 5J shows that a conductive layer 704 can be formed in a conformalmanner so as to cover the upper surface of the overmold 103 of eachmodule, the surface of each TMV 700, the exposed portion of thecorresponding contact pad, and the side walls of the module.Accordingly, the conductive layer 704 generally covering the upper sideand side walls of the module can be electrically connected to the groundplane corresponding packaging substrate 102 through the respectiveconductive-material-coated TMVs and through conductive features exposedon the side walls. Such a conformal coating of conductive material canbe applied by, for example, a deposition process such as a physicalvapor deposition (PVD) process.

FIG. 5J shows the resulting plurality of dual-sided shielded RF modules100, each having one or more components mounted on the first side (e.g.,upper side) of the corresponding packaging substrate 102, and one ormore components mounted on the second side (e.g., underside) of the samepackaging substrate 102. As described herein, theconductive-material-coated TMVs provide an electrical connection betweenthe conductive layer on the upper surface of the overmold 103 of eachmodule 100 and the contact pads (which are in turn electricallyconnected to a ground plane), to thereby provide shielding functionality(e.g., intra-module). As also described herein, suchconductive-material-coated TMVs can replace shielding wirebonds, therebyeliminating process steps such as formation of shielding wirebonds,exposing of upper portions of such shielding wirebonds (e.g., utilizingmicro-ablation technique), and formation of a conductive layer such as apainted metal layer to accommodate such shielding wirebonds.

As also described herein, the array of solder balls 712 implemented onthe underside of the packaging substrate 102 in the correspondingopenings 710 in the overmold 105 can allow the module 100 to be mountedon a circuit board. Additional details concerning such mounting with useof the solder ball array are described in Appendix B.

FIG. 6A shows a panel 130 having a plurality of units 131, where eachunit is configured to become a packaging substrate 102 once singulated.Each unit 131 can include one or more contact pads on its upper side,and it is assumed that each of such contact pad(s) is electricallyconnected to a ground plane within the packaging substrate 102. Eachunit 131 can also include a plurality of contact pads on its underside,and it is assumed that each of such contact pads are configured tofacilitate mounting of one or more components and/or to receiveconductive features such as solder balls.

FIG. 6B shows a plurality of components 107 a, 107 b mounted on theupper side of the packaging substrate 102 for each unit 131 of the panel130. Such components can include, for example, one or more die havingrespective integrated circuit(s), one or more surface mount devices(SMDs) such as passive components, or some combination thereof. Suchcomponents can be parts of an RF circuit assembly.

FIG. 6C shows that a first overmold structure 136 can be formed over thepackaging substrate panel 130 so as to cover each set of one or morecomponents 107 a, 107 b associated with the corresponding unit.

FIG. 6D shows a plurality of components 109 mounted on the underside ofthe packaging substrate panel 130. In the example shown, one component109 is mounted on the underside of each unit 131 of the panel 130;however, it will be understood that more than one component can bemounted thereto. Such components can include, for example, one or moredie having respective integrated circuit(s), one or more surface mountdevices (SMDs) such as passive components, or some combination thereof.Such components can be parts of an RF circuit assembly. FIG. 6D alsoshows a plurality of solder balls 712 mounted, implemented, formed,etc., on the underside of the packaging substrate 130. The plurality ofsolder balls 712 may be formed on contact pads on the underside of thepackaging substrate 130. Although solder balls 712 may be illustrated inFIG. 6D, one having ordinary skill in the art understands that othertypes of contact features, such as pillars, columns, posts, etc., may beused.

FIG. 6E shows that a second overmold structure 137 can be formed overthe packaging substrate panel 130 so as to cover each set of one or morecomponents 109 and the solder balls 712 associated with thecorresponding unit. In some embodiments, the overmold structure 137 maycompletely cover the solder balls 712. For example, the overmoldstructure 137 may cover the solder balls 712 such that a thin layer(e.g., a film, a coating, a thin sheet, etc.) of the over mold materialmay remain deposited over the solder balls 106.

FIG. 6F shows that one or more openings such as through-mold vias (TMVs)700 can be formed through the first overmold structure 136. Such TMVscan be formed to expose at least some of the corresponding contact padson the first side of the packaging substrate. In some embodiments, suchTMVs can be formed by, for example, laser drilling configured to burnthrough the first overmold material and generally stop once the contactpads are exposed. FIG. 6F also shows portions of the second overmoldstructure 137 may be removed. For example, a laser may be used to burnor melt portions of the second overmold structure 137 around the solderballs 712 to expose the solder balls through the second overmoldstructure 137. The assembly illustrated in FIG. 6F may be oriented andprepared to receive a conductive layer on the first overmold structure136.

FIG. 6H shows that a conductive layer 702 can be formed in a conformalmanner so as to cover the upper surface of the overmold 136, the surfaceof each TMV 700, and the exposed portion of the corresponding contactpad. Accordingly, the conductive layer 702 on the upper surface of theovermold 136 can be electrically connected to the ground planes in thepanel 130 through the respective conductive-material-coated TMVs. Such aconformal coating of conductive material can be applied by, for example,a deposition process such as a physical vapor deposition (PVD) process.

FIG. 6I shows that the assembly of FIG. 4I can be singulated into aplurality of dual-sided shielded RF modules 100, each having one or morecomponents mounted on the first side (e.g., upper side) of thecorresponding packaging substrate 102, and one or more componentsmounted on the second side (e.g., underside) of the same packagingsubstrate 102. As described herein, the conductive-material-coated TMVsprovide an electrical connection between the conductive layer on theupper surface of the overmold 103 of each module 100 and the contactpads (which are in turn electrically connected to a ground plane), tothereby provide shielding functionality (e.g., intra-module shieldingand/or overall shielding for the module). As also described herein, suchconductive-material-coated TMVs can replace shielding wirebonds, therebyeliminating process steps such as formation of shielding wirebonds,exposing of upper portions of such shielding wirebonds (e.g., utilizingmicro-ablation technique), and formation of a conductive layer such as apainted metal layer to accommodate such shielding wirebonds.

As also described herein, the array of solder balls 712 implemented onthe underside of the packaging substrate 102 in the correspondingopenings 710 in the overmold 105 can allow the module 100 to be mountedon a circuit board. Additional details concerning such mounting with useof the solder ball array are described in Appendix B.

FIG. 7A shows a panel 140 having a plurality of units 141, where eachunit is configured to become a packaging substrate 102 once singulated.Each unit 141 can include one or more contact pads on its upper side,and it is assumed that each of such contact pad(s) is electricallyconnected to a ground plane within the packaging substrate 102. Eachunit 141 can also include a plurality of contact pads on its underside,and it is assumed that each of such contact pads are configured tofacilitate mounting of one or more components and/or to receiveconductive features such as solder balls.

FIG. 7B shows a plurality of components 107 a, 107 b mounted on theupper side of the packaging substrate 102 for each unit 141 of the panel140. Such components can include, for example, one or more die havingrespective integrated circuit(s), one or more surface mount devices(SMDs) such as passive components, or some combination thereof. Suchcomponents can be parts of an RF circuit assembly.

FIG. 7C shows that a first overmold structure 146 can be formed over thepackaging substrate panel 140 so as to cover each set of one or morecomponents 107 a, 107 b associated with the corresponding unit.

FIG. 7D shows a plurality of components 109 mounted on the underside ofthe packaging substrate panel 140. In the example shown, one component109 is mounted on the underside of each unit 141 of the panel 140;however, it will be understood that more than one component can bemounted thereto. Such components can include, for example, one or moredie having respective integrated circuit(s), one or more surface mountdevices (SMDs) such as passive components, or some combination thereof.Such components can be parts of an RF circuit assembly. FIG. 7D alsoshows a plurality of solder balls 712 mounted, implemented, formed,etc., on the underside of the packaging substrate 130. The plurality ofsolder balls 712 may be formed on contact pads on the underside of thepackaging substrate 130. Although solder balls 712 may be illustrated inFIG. 7D, one having ordinary skill in the art understands that othertypes of contact features, such as pillars, columns, posts, etc., may beused.

FIG. 7E shows that a second overmold structure 147 can be formed overthe packaging substrate panel 140 so as to cover each set of one or morecomponents 109 and the solder balls 712 associated with thecorresponding unit. In some embodiments, the overmold structure 137 maycompletely cover the solder balls 712. For example, the overmoldstructure 137 may cover the solder balls 712 such that a thin layer(e.g., a film, a coating, a thin sheet, etc.) of the over mold materialmay remain deposited over the solder balls 106.

FIG. 7F shows that one or more openings such as through-mold vias (TMVs)700 can be formed through the first overmold structure 146. Such TMVscan be formed to expose at least some of the corresponding contact padson the first side of the packaging substrate. In some embodiments, suchTMVs can be formed by, for example, laser drilling configured to burnthrough the first overmold material and generally stop once the contactpads are exposed. FIG. 7F also shows portions of the second overmoldstructure 147 may be removed. For example, a laser may be used to burnor melt portions of the second overmold structure 147 around the solderballs 712 to expose the solder balls through the second overmoldstructure 147. The assembly of FIG. 7F may be oriented and prepared tobe singulated. It will be understood that the assembly of FIG. 7F canalso be singulated in the orientation as shown in FIG. 7F.

FIG. 7G show a plurality of unshielded modules 100′ resulting from asingulation process. Such unshielded modules can be process furtherutilizing, for example, a stencil. Additional details concerning suchstencil based processing of singulated devices are disclosed in AppendixA.

FIG. 7H shows that a conductive layer 704 can be formed in a conformalmanner so as to cover the upper surface of the overmold 103 of eachmodule, the surface of each TMV 700, the exposed portion of thecorresponding contact pad, and the side walls of the module.Accordingly, the conductive layer 704 generally covering the upper sideand side walls of the module can be electrically connected to the groundplane corresponding packaging substrate 102 through the respectiveconductive-material-coated TMVs and through conductive features exposedon the side walls. Such a conformal coating of conductive material canbe applied by, for example, a deposition process such as a physicalvapor deposition (PVD) process. FIG. 7H also shows the resultingplurality of dual-sided shielded RF modules 100, each having one or morecomponents mounted on the first side (e.g., upper side) of thecorresponding packaging substrate 102, and one or more componentsmounted on the second side (e.g., underside) of the same packagingsubstrate 102. As described herein, the conductive-material-coated TMVsprovide an electrical connection between the conductive layer on theupper surface of the overmold 103 of each module 100 and the contactpads (which are in turn electrically connected to a ground plane), tothereby provide shielding functionality (e.g., intra-module). As alsodescribed herein, such conductive-material-coated TMVs can replaceshielding wirebonds, thereby eliminating process steps such as formationof shielding wirebonds, exposing of upper portions of such shieldingwirebonds (e.g., utilizing micro-ablation technique), and formation of aconductive layer such as a painted metal layer to accommodate suchshielding wirebonds.

As also described herein, the array of solder balls 712 implemented onthe underside of the packaging substrate 102 in the correspondingopenings 710 in the overmold 105 can allow the module 100 to be mountedon a circuit board. Additional details concerning such mounting with useof the solder ball array are described in Appendix B.

FIG. 8A shows a panel 130 having a plurality of units 131, where eachunit is configured to become a packaging substrate 102 once singulated.Each unit 131 can include one or more contact pads on its upper side,and it is assumed that each of such contact pad(s) is electricallyconnected to a ground plane within the packaging substrate 102. Eachunit 131 can also include a plurality of contact pads on its underside,and it is assumed that each of such contact pads are configured tofacilitate mounting of one or more components and/or to receiveconductive features such as solder balls.

FIG. 8B shows a plurality of components 107 a, 107 b mounted on theupper side of the packaging substrate 102 for each unit 131 of the panel130. Such components can include, for example, one or more die havingrespective integrated circuit(s), one or more surface mount devices(SMDs) such as passive components, or some combination thereof. Suchcomponents can be parts of an RF circuit assembly.

FIG. 8C shows that a first overmold structure 136 can be formed over thepackaging substrate panel 130 so as to cover each set of one or morecomponents 107 a, 107 b associated with the corresponding unit.

FIG. 8D shows a plurality of components 109 mounted on the underside ofthe packaging substrate panel 130. In the example shown, one component109 is mounted on the underside of each unit 131 of the panel 130;however, it will be understood that more than one component can bemounted thereto. Such components can include, for example, one or moredie having respective integrated circuit(s), one or more surface mountdevices (SMDs) such as passive components, or some combination thereof.Such components can be parts of an RF circuit assembly. FIG. 8D alsoshows a plurality of solder balls 712 mounted, implemented, formed,etc., on the underside of the packaging substrate 130. The plurality ofsolder balls 712 may be formed on contact pads on the underside of thepackaging substrate 130. Although solder balls 712 may be illustrated inFIG. 6D, one having ordinary skill in the art understands that othertypes of contact features, such as pillars, columns, posts, etc., may beused.

FIG. 8E shows that a second overmold structure 137 can be formed overthe packaging substrate panel 130 so as to cover each set of one or morecomponents 109 and the solder balls 712 associated with thecorresponding unit. In some embodiments, the overmold structure 137 maycompletely cover the solder balls 712. For example, the overmoldstructure 137 may cover the solder balls 712 such that a thin layer(e.g., a film, a coating, a thin sheet, etc.) of the over mold materialmay remain deposited over the solder balls 106.

FIG. 8F shows that portions of the overmold structure 137 and the solderballs 712 may be removed. For example, the bottom surface (which isillustrated as facing up) may be ablated, ground, etc., to removeportions of the overmold structure 137 and the solder balls 712. Thismay expose the solder balls 712 through the overmold structure 712.

FIG. 8G shows that one or more openings such as through-mold vias (TMVs)700 can be formed through the first overmold structure 136. Such TMVscan be formed to expose at least some of the corresponding contact padson the first side of the packaging substrate. In some embodiments, suchTMVs can be formed by, for example, laser drilling configured to burnthrough the first overmold material and generally stop once the contactpads are exposed. The assembly illustrated in FIG. 6F may be orientedand prepared to receive a conductive layer on the first overmoldstructure 136.

FIG. 8G shows that a conductive layer 702 can be formed in a conformalmanner so as to cover the upper surface of the overmold 136, the surfaceof each TMV 700, and the exposed portion of the corresponding contactpad. Accordingly, the conductive layer 702 on the upper surface of theovermold 136 can be electrically connected to the ground planes in thepanel 130 through the respective conductive-material-coated TMVs. Such aconformal coating of conductive material can be applied by, for example,a deposition process such as a physical vapor deposition (PVD) process.

FIG. 8I shows that the assembly of FIG. 8I can be singulated into aplurality of dual-sided shielded RF modules 100, each having one or morecomponents mounted on the first side (e.g., upper side) of thecorresponding packaging substrate 102, and one or more componentsmounted on the second side (e.g., underside) of the same packagingsubstrate 102. As described herein, the conductive-material-coated TMVsprovide an electrical connection between the conductive layer on theupper surface of the overmold 103 of each module 100 and the contactpads (which are in turn electrically connected to a ground plane), tothereby provide shielding functionality (e.g., intra-module shieldingand/or overall shielding for the module). As also described herein, suchconductive-material-coated TMVs can replace shielding wirebonds, therebyeliminating process steps such as formation of shielding wirebonds,exposing of upper portions of such shielding wirebonds (e.g., utilizingmicro-ablation technique), and formation of a conductive layer such as apainted metal layer to accommodate such shielding wirebonds.

As also described herein, the array of solder balls 712 implemented onthe underside of the packaging substrate 102 in the correspondingopenings 710 in the overmold 105 can allow the module 100 to be mountedon a circuit board. Additional details concerning such mounting with useof the solder ball array are described in Appendix B.

FIG. 9A shows a panel 140 having a plurality of units 141, where eachunit is configured to become a packaging substrate 102 once singulated.Each unit 141 can include one or more contact pads on its upper side,and it is assumed that each of such contact pad(s) is electricallyconnected to a ground plane within the packaging substrate 102. Eachunit 141 can also include a plurality of contact pads on its underside,and it is assumed that each of such contact pads are configured tofacilitate mounting of one or more components and/or to receiveconductive features such as solder balls.

FIG. 9B shows a plurality of components 107 a, 107 b mounted on theupper side of the packaging substrate 102 for each unit 141 of the panel140. Such components can include, for example, one or more die havingrespective integrated circuit(s), one or more surface mount devices(SMDs) such as passive components, or some combination thereof. Suchcomponents can be parts of an RF circuit assembly.

FIG. 9C shows that a first overmold structure 146 can be formed over thepackaging substrate panel 140 so as to cover each set of one or morecomponents 107 a, 107 b associated with the corresponding unit.

FIG. 9D shows a plurality of components 109 mounted on the underside ofthe packaging substrate panel 140. In the example shown, one component109 is mounted on the underside of each unit 141 of the panel 140;however, it will be understood that more than one component can bemounted thereto. Such components can include, for example, one or moredie having respective integrated circuit(s), one or more surface mountdevices (SMDs) such as passive components, or some combination thereof.Such components can be parts of an RF circuit assembly. FIG. 9D alsoshows a plurality of solder balls 712 mounted, implemented, formed,etc., on the underside of the packaging substrate 130. The plurality ofsolder balls 712 may be formed on contact pads on the underside of thepackaging substrate 130. Although solder balls 712 may be illustrated inFIG. 9D, one having ordinary skill in the art understands that othertypes of contact features, such as pillars, columns, posts, etc., may beused.

FIG. 9D shows that a second overmold structure 147 can be formed overthe packaging substrate panel 140 so as to cover each set of one or morecomponents 109 and the solder balls 712 associated with thecorresponding unit. In some embodiments, the overmold structure 137 maycompletely cover the solder balls 712. For example, the overmoldstructure 137 may cover the solder balls 712 such that a thin layer(e.g., a film, a coating, a thin sheet, etc.) of the over mold materialmay remain deposited over the solder balls 106.

FIG. 9E shows that portions of the overmold structure 137 and the solderballs 712 may be removed. For example, the bottom surface (which isillustrated as facing up) may be ablated, ground, etc., to removeportions of the overmold structure 137 and the solder balls 712. Thismay expose the solder balls 712 through the overmold structure 712.

FIG. 9F shows that one or more openings such as through-mold vias (TMVs)700 can be formed through the first overmold structure 146. Such TMVscan be formed to expose at least some of the corresponding contact padson the first side of the packaging substrate. In some embodiments, suchTMVs can be formed by, for example, laser drilling configured to burnthrough the first overmold material and generally stop once the contactpads are exposed. The assembly of FIG. 7F may be oriented and preparedto be singulated. It will be understood that the assembly of FIG. 7F canalso be singulated in the orientation as shown in FIG. 7F.

FIG. 9G show a plurality of unshielded modules 100′ resulting from asingulation process. Such unshielded modules can be process furtherutilizing, for example, a stencil. Additional details concerning suchstencil based processing of singulated devices are disclosed in AppendixA.

FIG. 9G shows that a conductive layer 704 can be formed in a conformalmanner so as to cover the upper surface of the overmold 103 of eachmodule, the surface of each TMV 700, the exposed portion of thecorresponding contact pad, and the side walls of the module.Accordingly, the conductive layer 704 generally covering the upper sideand side walls of the module can be electrically connected to the groundplane corresponding packaging substrate 102 through the respectiveconductive-material-coated TMVs and through conductive features exposedon the side walls. Such a conformal coating of conductive material canbe applied by, for example, a deposition process such as a physicalvapor deposition (PVD) process. FIG. 9G also shows the resultingplurality of dual-sided shielded RF modules 100, each having one or morecomponents mounted on the first side (e.g., upper side) of thecorresponding packaging substrate 102, and one or more componentsmounted on the second side (e.g., underside) of the same packagingsubstrate 102. As described herein, the conductive-material-coated TMVsprovide an electrical connection between the conductive layer on theupper surface of the overmold 103 of each module 100 and the contactpads (which are in turn electrically connected to a ground plane), tothereby provide shielding functionality (e.g., intra-module). As alsodescribed herein, such conductive-material-coated TMVs can replaceshielding wirebonds, thereby eliminating process steps such as formationof shielding wirebonds, exposing of upper portions of such shieldingwirebonds (e.g., utilizing micro-ablation technique), and formation of aconductive layer such as a painted metal layer to accommodate suchshielding wirebonds.

As also described herein, the array of solder balls 712 implemented onthe underside of the packaging substrate 102 in the correspondingopenings 710 in the overmold 105 can allow the module 100 to be mountedon a circuit board. Additional details concerning such mounting with useof the solder ball array are described in Appendix B.

In some implementations, a device and/or a circuit having one or morefeatures described herein can be included in an RF electronic devicesuch as a wireless device. In some embodiments, such a wireless devicecan include, for example, a cellular phone, a smart-phone, a hand-heldwireless device with or without phone functionality, a wireless tablet,etc.

FIG. 10 depicts an example wireless device 1400 having one or moreadvantageous features described herein. In the example of FIG. 15, ashielded RF module having one or more features as described herein canbe implemented in a number of places. For example, a shielded RF modulemay be implemented as a front-end module (FEM) indicated as 100 a. Inanother example, a shielded RF module may be implemented as a poweramplifier module (PAM) indicated as 100 b. In another example, ashielded RF module may be implemented as an antenna switch module (ASM)indicated as 100 c. In another example, a shielded RF module may beimplemented as a diversity receive (DRx) module indicated as 100 d. Itwill be understood that a shielded RF module having one or more featuresas described herein can be implemented with other combinations ofcomponents.

Referring to FIG. 10, power amplifiers (PAs) 1420 can receive theirrespective RF signals from a transceiver 1410 that can be configured andoperated to generate RF signals to be amplified and transmitted, and toprocess received signals. The transceiver 1410 is shown to interact witha baseband sub-system 1408 that is configured to provide conversionbetween data and/or voice signals suitable for a user and RF signalssuitable for the transceiver 1410. The transceiver 1410 can also be incommunication with a power management component 1406 that is configuredto manage power for the operation of the wireless device 1400.

The baseband sub-system 1408 is shown to be connected to a userinterface 1402 to facilitate various input and output of voice and/ordata provided to and received from the user. The baseband sub-system1408 can also be connected to a memory 1404 that is configured to storedata and/or instructions to facilitate the operation of the wirelessdevice, and/or to provide storage of information for the user.

In the example wireless device 1400, outputs of the PAs 1420 are shownto be matched (via respective match circuits 1422) and routed to theirrespective duplexers 1424. Such amplified and filtered signals can berouted to a primary antenna 1416 through an antenna switch 1414 fortransmission. In some embodiments, the duplexers 1424 can allow transmitand receive operations to be performed simultaneously using a commonantenna (e.g., primary antenna 1416). In FIG. 10, received signals areshown to be routed to “Rx” paths that can include, for example, alow-noise amplifier (LNA).

In the example of FIG. 10, the wireless device 1400 also includes thediversity antenna 1426 and the shielded DRx module 100 d that receivessignals from the diversity antenna 1426. The shielded DRx module 100 dprocesses the received signals and transmits the processed signals via atransmission line 1435 to a diversity RF module 1411 that furtherprocesses the signal before feeding the signal to the transceiver 1410.

Unless the context clearly requires otherwise, throughout thedescription and the claims, the words “comprise,” “comprising,” and thelike are to be construed in an inclusive sense, as opposed to anexclusive or exhaustive sense; that is to say, in the sense of“including, but not limited to.” The word “coupled”, as generally usedherein, refers to two or more elements that may be either directlyconnected, or connected by way of one or more intermediate elements.Additionally, the words “herein,” “above,” “below,” and words of similarimport, when used in this application, shall refer to this applicationas a whole and not to any particular portions of this application. Wherethe context permits, words in the above Description using the singularor plural number may also include the plural or singular numberrespectively. The word “or” in reference to a list of two or more items,that word covers all of the following interpretations of the word: anyof the items in the list, all of the items in the list, and anycombination of the items in the list.

The above detailed description of embodiments of the invention is notintended to be exhaustive or to limit the invention to the precise formdisclosed above. While specific embodiments of, and examples for, theinvention are described above for illustrative purposes, variousequivalent modifications are possible within the scope of the invention,as those skilled in the relevant art will recognize. For example, whileprocesses or blocks are presented in a given order, alternativeembodiments may perform routines having steps, or employ systems havingblocks, in a different order, and some processes or blocks may bedeleted, moved, added, subdivided, combined, and/or modified. Each ofthese processes or blocks may be implemented in a variety of differentways. Also, while processes or blocks are at times shown as beingperformed in series, these processes or blocks may instead be performedin parallel, or may be performed at different times.

The teachings of the invention provided herein can be applied to othersystems, not necessarily the system described above. The elements andacts of the various embodiments described above can be combined toprovide further embodiments.

While some embodiments of the inventions have been described, theseembodiments have been presented by way of example only, and are notintended to limit the scope of the disclosure. Indeed, the novel methodsand systems described herein may be embodied in a variety of otherforms; furthermore, various omissions, substitutions and changes in theform of the methods and systems described herein may be made withoutdeparting from the spirit of the disclosure. The accompanying claims andtheir equivalents are intended to cover such forms or modifications aswould fall within the scope and spirit of the disclosure.

What is claimed is:
 1. A method for manufacturing a dual-sided module,the method comprising: providing or forming a packaging substrate havingan upper side, a lower side, and a ground plane; implementing aradio-frequency circuit assembly on both of the upper and lower sides ofthe packaging substrate; forming an upper overmold on the upper side ofthe packaging substrate to cover an upper portion of the radio-frequencycircuit assembly; forming one or more openings through the upperovermold to expose one or more contact pads on the upper side of thepackaging substrate, the one or more contact pads in electricalconnection with the ground plane; covering an upper surface and the oneor more openings of the upper overmold with a conductive layer to be inelectrical contact with the ground plane to thereby provide shieldingfor a region on the upper side of the packaging substrate; implementinga plurality of contact features on the lower side of the packagingsubstrate; forming a lower overmold on the lower side of the packagingsubstrate to cover a lower portion of the radio-frequency circuitassembly and some or all of each of the contact features on the lowerside of the packaging substrate; and processing the lower overmold toexpose the contact features to allow the dual-sided module to be mountedon a circuit board.